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The PELCO® FIB Lift-Out TEM Grids have been designed for in-situ lift to attach the TEM lamellas milled out by SEM/FIB or FIB systems
Tip Geometry: High Aspect Ratio Tip Height: 10 - 15 Front Angle: 1 ± 0
Type-A Carbon
10μm Pitch
The nominal diameter of the sturdy PELCO® FIB Lift-Out Grids is 3mm
Substratek™ TEM Metallic Substrates on 300 mesh TEM grids Material:Titania (TiOx) The PELCO® FIB Lift-Out TEMDESCRIPTION Innovative experimental nanotech TEM supports Substratek TEM Substrates are ultrathin metallic support films on standard 3mm TEM grids. These metallic films are specially manufactured with a patented process (US Patent #7348570 B2, March 25, 2008) as experimental platforms and are electron transparent to allow for imaging using a TEM. The ultrathin Substratek TEM Substrates enable electrochemical processing, crystal growth, and nano and
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